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Commerce Dept to demand equity from 7 tech companies as a condition to tap into millions in federal funding

The equity is ‘to enhance the return for the US taxpayer,’ the department says

The Commerce Department indicated that the federal government is on track to dole out millions of dollars to seven companies to fund technology development but will require the businesses to fork over equity in exchange for the money.

“The Department of Commerce today announced the signing of 7 letters of intent to provide $874 million in federal incentives under the CHIPS and Science Act,” a Wednesday press release noted. “These incentives will support innovative domestic technologies to dramatically increase the performance of the world’s fastest computers, secure domestic supply chains, and strengthen U.S. leadership in the compute supply chain.”

The CHIPS and Science Act was passed by Congress and signed by President Joe Biden in 2022.

The seven companies, which include GlobalFoundries, Kepler, Multibeam Corporation, Extropic, Thintronics, OBSIDIA Semiconductors and Aeluma, “have entered into letters of intent with the Department of Commerce, and there will be further diligence and approval by the Department before final awards are made,” according to the announcement, which is posted on the National Institute of Standards and Technology site. “The Department will receive a minority, non-controlling equity stake in each company as a condition for receiving the funds to enhance the return for the U.S. taxpayer.”

The department detailed the planned funding allotments for each company should the government move forward.

“GlobalFoundries will receive up to $300 million to accelerate the domestic research and development of co-packaged optics by two to three years. By integrating photonics directly alongside AI processors, this technology will deliver ultra-fast, energy-efficient computing to reinforce U.S. leadership in AI infrastructure,” the release noted. “Kepler will receive up to $245 million for R&D to develop in the U.S. a new class of high-performance AI memory technology enabled by innovative 3D and ferroelectric technologies.”

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